December

Complete Series C financing

November

Serving overseas TIER1 customers, automotive electronic solutions in joint venture brands Mass production of vehicle models

August

Release Bluetooth® Core 5.4 protocol stack

June

Release Bluetooth® Core 5.4 specification low-power chip BR1601, enter the remote control Market, Obtaining Operating Trademark Cases

March

Release dual-mode chip BR8654 and enter the adapter market

January

Intelligent manufacturing factory with a production capacity of 3KK

November

National level specialized and innovative "little giant" enterprise

August

Release Bluetooth®+WI-FI6/6E COMBO 2-in-1 module

May

Automotive electronic solutions are mass-produced in TOYOTA, HONDA, VW and other car manufacturers' models

February

BR series chips enter the set-top box, remote control, power and other markets and obtain operating trademark cases

January

Intelligent manufacturing factory officially put into operation

December

Beijing specialized, refined, unique, and innovative small and medium-sized enterprises

November

Complete Series B financing

September

Release Bluetooth V5.3 and LE AUDIO protocol stack

August

Automotive electronic solutions are mass-produced in car models such as DAIMLER, FORD, NISSAN, etc

July

Mass production of automotive electronic digital key solution

May

Bluetooth 5.1 dual-mode chip BR8551/8651 mass-produced

March

Bluetooth 5.2 low-power chip BR1002 mass-produced

February

BR series chips enter the automotive electronics aftermarket, charging stations, and feature phone market

January

Establish an intelligent manufacturing center with an area of 3300 square meters

December

ISO9001 certification

July

Release the BARROT LC3 algorithm

May

Release Bluetooth®+WI-FI 5-in-1 car scale group

March

Automotive electronic solutions are used in car manufacturers such as Nissan, General Motors, Volkswagen, and Hyundai Mass production in the model

February

Bluetooth® Core 5.1 chip BR8051/8052 enters mass production and enters the adapter and host like market

December

Zhongguancun Frontier Technology Enterprise

August

Bluetooth®Core 5.2 and LE AUDIO Protocol, LC3 Algorithm Developer

April

Release Automotive WI-FI Solution

March

Leading domestic micro Bluetooth® solution: Xiaomi printer using BR8041 achieves shipment of over one million sets

January

Bluetooth® Core 5.2 low-power chip BR1001 is fully mass-produced

November

Deng Bai Certified Enterprise

October

Complete Series A financing

July

Third place in the field of integrated circuits at the Zhongguancun International Frontier Technology Innovation Competition

May

Authorize IP to domestic mobile phone giants such as OPPO and Xiaomi to assist manufacturers in building a wearable Bluetooth® ecosystem

February

Automotive electronic solutions are being mass-produced in FAW, Volkswagen, and Jetta models

January

The first independently designed chip BR8041 has entered mass production and entered the micro printing market. We have independently designed Bluetooth® low-power chips

December

Senior member of Bluetooth International Organization and Bluetooth® protocol developer

June

Release BARROT Bluetooth® protocol MESH protocol stack

April

Independently designed Bluetooth® Dual-Mode (Qualified against Bluetooth® Core 5.0) chip

February

Layout of the automotive track: Qualcomm Automotive Electronics Bluetooth®/WI-FI authorization stack and design center

January

Bluetooth®+WI-FI 2-in-1 vehicle grade module mass-produced, entering the front-end automotive market